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文章通过数值仿真与试验测试分析,研究了在温度循环情况下不同尺寸球栅阵列(BGA)封装的可靠性。首先,建立了BGA封装结构的仿真模型,设置了与实际情况相对应的仿真条件和仿真边界,经过数值仿真得到不同尺寸BGA封装的可靠性分析结果。接下来通过温度循环实验测试,统计封装样品的失效率来评价其可靠性。文章的数值仿真结论与试验统计结果相一致,为封装设计的选型提供了参考。
Through numerical simulation and test analysis, the article studies the reliability of different size ball grid array (BGA) package under the condition of temperature cycling. First of all, the simulation model of BGA package structure is established, and the simulation conditions and simulation boundaries corresponding to the actual situation are set up. The reliability analysis results of BGA packages with different sizes are obtained through numerical simulation. Then through the temperature cycle experimental test, statistics package failure rate to evaluate the reliability of the sample. The numerical simulation conclusion of the article is consistent with the experimental statistical results, which provides a reference for the selection of package design.