由日立与我国台湾联电合资成立的Trecenti Technologies,于12月4日宣布,已比原定时间提前两个月,成功制造出全球第一批12in晶片。这批12in晶片同时也是全球首批从12in晶片的专业制造厂生产出来的。联电指出,这批采用了0.18μm的制造工艺,生产的4MB及8MB的静态随机存取内存(SRAM)晶片,其合格率可达预期水平, 预计将于2001年第一季度正式投入量产。 Trecenti Technologies, a joint venture between Hitachi and UMC Taiwan, announced on December 4 that it has successfully manufactured the world’s first 12-inch wafers two months earlier than originally scheduled. The 12-inch wafers are also the first ones in the world to be produced from professional 12-inch wafers. UMC pointed out that this batch of 0.18μm manufacturing process, the production of 4MB and 8MB of SRAM SRAM chip, the pass rate up to the expected level, is expected to be formally put into mass production in the first quarter of 2001.