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利用超微磨粒的电泳特性，在加工过程中使超微磨粒向工具泳动并沉积在工具表面，形成一动态的超微磨粒层，对脆性材料表面进行精密加工。本文介绍超微磨粒层的形成机理和特性，并通过对硅片进行电泳磨削的实验数据，看重讨论该技术的工艺特性及其对脆性材料加工质量的影响。研究结果表明，该加工技术能明显地降低被加工表面的粗糙度。
The use of ultra-abrasive particles of the electrophoresis characteristics in the process of ultra-abrasive particles move to the tool and deposited on the tool surface, the formation of a dynamic layer of ultra-abrasive, brittle material surface precision machining. This paper introduces the mechanism and characteristics of the formation of the ultrafine abrasive layer, and through the experimental data of the electrophoresis grinding of the silicon wafer, the technological characteristics of the technology and the impact on the processing quality of the brittle material are mainly discussed. The results show that the processing technology can significantly reduce the roughness of the machined surface.