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采用冷压烧结-热挤压复合加工工艺制备了纳米颗粒SiC增强铜基复合材料,研究了SiCP/Cu基复合材料的微观组织、显微硬度、力学性能、导电性能和耐磨性能。结果表明:采用本方法可获得组织致密的纳米SiCP/颗粒增强Cu基复合材料,纳米SiC颗粒以团聚状态分布在铜基体内;SiCP/Cu复合材料具有优良的导电性能和力学性能,可进行冷轧等二次加工;该复合材料的抗拉强度则有一个先升后降的过程,当纳米SiC颗粒含量增加到10%时,无法进行热挤压加工;该复合材料的耐磨性比工业纯铜好,但是比QCu差。
The microstructure, microhardness, mechanical properties, electrical conductivity and wear resistance of SiCP / Cu matrix composites were investigated by cold press sintering and hot extrusion process. The results show that nano-SiCP / particle reinforced Cu matrix composites with compact structure can be obtained by this method. The nano-SiC particles are distributed in the copper matrix in the agglomeration state. SiCP / Cu composite has excellent conductivity and mechanical properties, Rolling and other secondary processing; the tensile strength of the composite material has a rise first and then drop process, when the nano SiC particle content increased to 10%, the hot extrusion process can not be carried out; the wear resistance of the composite material than the industry Copper is good, but worse than QCu.