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随着集成电路集成度的不断提高,制造工艺水平的不断提升,集成电路处理的信号频率由MHz向GHz逐步提升,管脚数量和密度也快速增加,从而对PCB板设计的要求就越来越高。在PCB板设计中需要考虑诸多因素,其中电磁干扰(EMI)和电磁兼容(EMC)问题既复杂又棘手,而且又必须考虑并需要解决。解决问题的方案有很多,其中包括地线设计方案。
With the continuous improvement of the integrated circuit integration and the improvement of the manufacturing technology, the signal frequency processed by the integrated circuit is gradually increased from MHz to GHz, and the number of pins and the density also rapidly increase, thereby increasing the requirements for the design of the PCB board high. There are many factors that need to be considered in PCB design. The EMI and EMC issues are complex and difficult, and they must be considered and solved. There are many solutions to the problem, including ground design.