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Z-pin技术是一种有效的复合材料层间增强方法,本文对苯并恶嗪树脂的Z-pin拉挤工艺进行了深入研究。以差热扫描量热仪(Differentialscanningcalorimeter,DSC)分析苯并恶嗪固化特性为基础,结合外观检查和Z-pin短梁剪切试验研究得到合适的拉挤模具温度。设计了Z-pin拔脱试验并利用该试验研究了后烘道温度对Z-pin与层合板结合强度的影响,获得了后烘道的最优温度。最后分析了Z-pi的显微照片并对Z-pin质量进行整体评价。结果表明,苯并恶嗪树脂加热至70°C时,其粘度可满足拉挤需要,工艺适用期约为4h;随着模具温度的升高至140°C,Z-pin的短梁剪切强度逐渐提高,并且截面形状圆度更佳;随着后烘道温度降低,Z-pin与层合板的结合强度提高,但当温度低于200°C时,Z-pin内部出现了气泡,后烘道温度的最佳温度为200°C。
Z-pin technology is an effective composite layer enhancement method. In this paper, the Z-pin pultrusion technology of benzoxazine resin has been studied deeply. Based on the differential scanning calorimetry (DSC) analysis of the curing properties of benzoxazine, a suitable pultrusion die temperature was obtained by visual inspection and Z-pin short beam shear test. The Z-pin pull-out test was designed and the influence of post-bake temperature on the bond strength between Z-pin and the laminate was studied. The optimum temperature of bake oven was obtained. Finally, the Z-pi micrograph was analyzed and the Z-pin quality was evaluated as a whole. The results show that when the benzoxazine resin is heated to 70 ° C, the viscosity of the benzoxazine resin can meet the requirements of pultrusion. The pot life of the benzoxazine resin is about 4 hours. With the increase of the mold temperature to 140 ° C, The strength of the Z-pin increases with the increase of the circularity of the cross-sectional shape. The bonding strength of the Z-pin and the laminated plate increases with the decrease of the post-bake temperature. However, when the temperature is below 200 ° C, The best temperature for the drying tunnel is 200 ° C.