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射频部分在手机材料清单(BOM)中的比重越来越大,过去使用的GaAs PA(功放)技术,由于成本较高,受到了CMOS技术的挑战。2008年10月,美国Axiom Microdevices展示了该公司的CMOS PA技术,以替代传统砷化镓(GaAs)功放的解决方案,高度集成化的CMOS PA的单芯片技术避免了复杂而昂贵的多
The radio part is taking up a bigger and bigger portion of the bill of materials (BOM) and the GaAs PA (power amplifier) technology used in the past has been challenged by CMOS technology because of its high cost. In October 2008, Axiom Microdevices from the United States demonstrated its CMOS PA technology to replace the traditional GaAs power amplifier solution. The highly integrated CMOS PA single-chip technology avoids the complexity and costly