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近些年来,印制电路板业界对环境保护的要求迅速升温.该公司已经开发并掌握了无卤核心技术.包括树脂体系技术和高填充量控制技术.作为树脂技术,开发了一种新型的树脂体系(RO树脂),它的特点是将大量的氮引入到分子主链结构中;而高填充量控制技术的核心则是开发了一种新的填料界面控制系统(FICS),它能使填料有足够高的分散度.采用这些技术,可以制成符合要求的多种无卤型基材.包括MCL-RO-67G(下面讨论的TL-A),用作多层PWB的薄型层压板MCF-4000G(后面将讨论的HD-B),用于高密度互连的增层法基材MCL-E-679F(G)(文章中讨论的HiTg),以及用于先进芯片塑料封装(PKGs)的高Tg层压板和PWB.这些基材有着优异的耐热性,并且很适合于无铅焊锡互连.与通用的基材相比,这些基材对于温度、潮湿和频率有着更好的稳定性.采用这些新型基材使环保型产品的设计、制造变得非常之容易.该公司还正在研发不久的将来所需要的适用于高频、高速、高可靠性PWB基材以及新型封装用基材.
In recent years, the printed circuit board industry’s environmental protection requirements are rapidly warming.The company has developed and mastered the core technology of halogen-free, including resin system technology and high filling control technology.As a resin technology, has developed a new Resin system (RO resin), which is characterized by a large amount of nitrogen introduced into the molecular structure of the main chain; and high-filling control technology is the core of the development of a new filler interface control system (FICS) The fillers have a sufficiently high degree of dispersion that these qualities make it possible to produce a wide range of halogen-free compliant substrates, including MCL-RO-67G (TL-A discussed below), thin laminates for multilayer PWB MCF-4000G (HD-B to be discussed later), build-up substrate MCL-E-679F (G) for high density interconnects (HiTg discussed in the article), and for advanced chip plastic packages ) High Tg laminates and PWBs, which have excellent heat resistance and are ideally suited for lead-free solder interconnects, which are better for temperature, humidity and frequency than common substrates Stability. The use of these new substrates makes eco-friendly products easy to design and manufacture. The company is also developing PWB substrates for high-frequency, high-speed, high-reliability, and new packaging substrates needed in the near future.