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通过等离子喷涂技术在铜合金基体上制备具有不同适配层的钨涂层第一壁复合材料,并对其界面行为进行研究。结果表明,W/Cu、NiCrAl和Ti适配层均能明显降低W/Cu界面热应力,但其界面仍是第一壁复合材料最可能失效的位置;W/Cu适配层能有效提高此复合材料界面的结合强度,增幅高达30%。
The tungsten-coated first wall composites with different adaptation layers were prepared on the copper alloy substrate by plasma spray technique and their interfacial behaviors were studied. The results show that both W / Cu and NiCrAl and Ti adaption layers can significantly reduce the W / Cu interfacial thermal stress, but the interface is still the most likely failure site of the first wall composites. W / Cu intercalation layer can effectively improve this Composite interface bonding strength, an increase of up to 30%.