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1.前言 半导体硅片的清洗工艺是半导体器件生产中最关键的工艺之一。它对器件的特性及其可靠性有着决定的作用。至今为止,国内半导体器件生产工艺中几乎全部使用具有强烈腐蚀性的氧化剂或无机酸,如硝酸、硫酸、双氧水、盐酸等试剂。这些试剂因为具有强烈的腐蚀性,所以经常侵蚀设备,污染环境,损害工人的身体健康,而且这些试剂的价格也比较昂贵,因而也提高了器件的成本。
1. Introduction Semiconductor wafer cleaning process is one of the most critical processes in the manufacture of semiconductor devices. It has a decisive effect on the device's characteristics and its reliability. So far, almost all of the domestic semiconductor device production process using a strong corrosive oxidants or inorganic acids, such as nitric acid, sulfuric acid, hydrogen peroxide, hydrochloric acid and other reagents. Because of their strong corrosiveness, these reagents often erode equipment, pollute the environment, damage the health of workers, and the cost of these reagents is relatively high, thereby increasing the cost of the device.