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以环氧树脂为材料,用简单、低成本的非接触式光刻法制作多模光波导。通过实验,找出一种可靠有效的有机溶剂作为显影剂及其相应的显影时间;并研究了温湿度和旋涂工艺对光波导厚度的影响;以及光刻掩模版透光部分宽度、光刻掩模版与下包层之间的间距、曝光光强和曝光时间对光波导宽度的影响。扫描电子显微镜(SEM)对样品形貌分析表明,脊形光波导表面光滑且侧壁笔直,光波导芯横截面约为50μm×50μm。采用cut-back法,测出环氧树脂多模光波导的传输损耗为0.1dB/cm@850nm。考虑到光电集成过程中对光波导的高温冲击,对样品进行了热稳定性试验,获得的最高稳定温度为210℃。
Using epoxy resin as a material, a multimode optical waveguide is fabricated by simple, low-cost non-contact photolithography. Through experiments, find a reliable and effective organic solvent as a developer and its corresponding development time; and temperature and humidity and spin-coating process on the optical waveguide thickness; and photolithographic reticle width of the light transmission, lithography The influence of the distance between the reticle and the under cladding layer, the exposure light intensity and the exposure time on the optical waveguide width. Scanning electron microscopy (SEM) analysis of the sample topography shows that the surface of the ridge waveguide is smooth and the sidewall is straight, and the waveguide core cross section is about 50 μm × 50 μm. Using cut-back method, measured the transmission loss of epoxy multimode optical waveguide is 0.1dB / cm@850nm. Taking into account the high-temperature impact on the optical waveguide during the photoelectric integration process, the thermal stability of the sample was tested and the highest stable temperature obtained was 210 ° C.