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用两种靶材,采用磁控反应溅射沉积Ti-Al-V-N薄膜。XRD和XPS测定薄膜的结构主要为BI-NaCl型Ti(Al、V)N相。SEM观察确定微观结构比较致密,晶粒直径约0.1μm;元素面分布均匀;主要成份与靶材基本一致。氧化试验表明Ti(Al、V)N抗氧化性远优于TiN,高铝薄膜尤为明显,对Cu、Al等浸润角动态观察和测量结果表明:Ti(Al、V)N涂层明显区别于无涂层的合金钢抛光表面。
Ti-Al-V-N films were deposited by magnetron reactive sputtering using two targets. The structures of the films determined by XRD and XPS are mainly BI-NaCl type Ti (Al, V) N phase. SEM observation shows that the microstructure is compact and the grain diameter is about 0.1μm. The element surface is evenly distributed. The main components are basically the same as the target. Oxidation tests showed that the oxidation resistance of Ti (Al, V) N is much better than that of TiN, especially for high-aluminum films. The dynamic observation and measurement of the wetting angles of Cu and Al show that the Ti (Al, V) Uncoated alloy steel polished surface.