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1.什么是表面安装技术 70年代后期,由于微电子组装技术的发展,芯片找体、电阻芯片、电容芯片、片状晶体管与印制板高密度组装得到了大力的开发,出现一个新的技术术语——表面安装技术(Surface Mounted Technology,缩写为SMT)。表面安装技术的内容包括适合表面安装的元器件(称为表面安装器件,缩写SMD)、基板、取放设备、元器件粘贴、焊接、测试和设计等一整套技术。广义看,混合集成电路早就应用了表面安装技术,基板可以是陶瓷基
1. What is the surface mount technology In the late 1970s, due to the development of microelectronic assembly technology, chip body, resistor chip, capacitor chip, chip transistor and PCB high-density assembly has been vigorously developed, there has been a new technology Terminology - Surface Mounted Technology (SMT). Surface mount technologies include a complete suite of surface mount components (called surface mount devices, abbreviated SMDs), substrates, pick and place equipment, component pasting, soldering, testing and design. Broadly speaking, hybrid integrated circuits have long been used surface mount technology, the substrate can be ceramic