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本文通过透射电镜观察了常规施肥与施用大豆专用复肥对轮作、连作大豆叶片超微结构的影响。结果发现，大豆连作导致叶绿体基粒片层结构破坏，淀粉粒积累，基粒片层结构出现“空隙区”。与常规施肥相比，施用复肥增强了轮作、连作大豆叶片叶绿体基粒片层结构的完整性，增加了基粒数量和基粒片层数，为促进大豆叶片的光合作用创造了条件，相关分析表明，叶绿体基粒片层数与大豆植株营养生长呈显著正相关。
In this paper, the effects of conventional fertilization and soybean special compound fertilizer on the ultrastructure of soybean leaves were observed by transmission electron microscopy. The results showed that continuous cropping of soybean led to the destruction of the structure of chloroplast grana lamellae and accumulation of starch granules, and the “gap zone” appeared in the grana lamellar structure. Compared with conventional fertilization, application of compound fertilizer enhanced the integrity of chloroplast grana lamellae in crop rotation and continuous cropping, increased the number of basal grains and the number of basal granule layers, and created the conditions for promoting the photosynthesis of soybean leaves. The correlation Analysis showed that there was a significant positive correlation between the number of grana tablets and the vegetative growth of soybean plants.