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本文系邮电部508厂编写组根据美国集成电路工程公司编制的《集成电路芯片技术手册》(至今尚未公开发表)编译而成.文中较详细地介绍了硅材料制备、器件制作工艺技术、双极型集成电路和各种MOS电路的特殊制作技术.同时文中还给出了许多很有用的工艺技术数据和图表,可供从事半导体教学、科研和生产的同志们查阅参考.就集成电路芯片制作技术而言,本文内容是比较全面而新颖的,但由于篇幅较长,我们将分期连载发表.又因我们水平有限,文中错误在所难免,望读者批评指正.
This article is compiled by the Ministry of Posts and Telecommunications 508 plant compiled according to the “integrated circuit chip technology manual” (has not yet been published) compiled by the American integrated circuit engineering company compiled.This paper describes in more detail silicon material preparation, device fabrication technology, bipolar Type integrated circuits and a variety of special MOS circuit manufacturing technology.At the same time, the article also gives a lot of useful technical data and charts for the semiconductor teaching, research and production of comrades reference.On the integrated circuit chip production technology In terms of this article is more comprehensive and novel, but due to the length of longer, we will be published in installments because of our limited level, the error is inevitable in the paper, hope readers criticism and correction.