美国桑迪亚国家实验室的研究人员开发一项蚀刻硅,以形成微型传感器和其他器件的新制造法。 通常,这些三维结构的刻蚀是难以用普通的光刻工艺和化学蚀刻法进行精密控制的,因此蚀刻表面粗糙,而不是镜面或精整面。 Researchers at Sandia National Laboratory in the United States have developed a process for etching silicon to create new manufacturing methods for micro-sensors and other devices. In general, the etching of these three-dimensional structures is difficult to precisely control with ordinary photolithography and chemical etching, so the etched surface is rough instead of specular or finishing.