论文部分内容阅读
研究了用复合电沉积法制备ＳｉＣ_ｐ／Ｃｕ复合材料的工艺。结果表明，用复合电沉积法制备颗粒增强金属基复合材料是一种切实可行的方法。当镀液中ＳｉＣ颗粒含量为１５ｇ／１，电流密度为４Ａ／ｄｍ￣２，电镀温度１５～２０℃，板泵搅拌时，可获得含有２０ｖｏｌ％ＳｉＣ_ｐ的ＳｉＣ_ｐ／Ｃｕ复合材料。
The preparation of SiC_p / Cu composites by composite electrodeposition was studied. The results show that composite electrodeposition of particle reinforced metal matrix composites is a practical method. When the content of SiC particles in the bath is 15g / 1, the current density is 4A / dm ~ 2 and the plating temperature is 15 ~ 20 ℃, the SiCp / Cu composites containing 20vol% SiCp can be obtained when the pump is stirred.