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在福建省科技重大专项、中科院院地合作专项等资助下,中科院海西研究院协同其产业化平台中科芯源公司研发出透明荧光陶瓷这一新型封装材料,获得了优异且稳定的LED发光效率与发光性能,以及透明荧光陶瓷大功率COB封装技术,可广泛应用于广场、港口、机场等领域,填补了LED户外照明领域空白,并成功实现产业化。该技术已于6月完成全球专利布局,表明中国LED产业已率先跨入大功率
Under the support of major projects of science and technology of Fujian Province and special cooperation of CAS and other institutes, the Hercynian Research Institute of the Chinese Academy of Sciences cooperated with its industrialization platform, Zhongli Core Technology Co., Ltd., developed a new type of transparent fluorescent ceramic encapsulation material and obtained excellent and stable LED luminescence Efficiency and luminous performance, as well as high-power transparent fluorescent ceramic COB packaging technology, can be widely used in square, port, airport and other fields, to fill the field of LED outdoor lighting blank, and the successful industrialization. The technology has been completed in June global patent layout, indicating that China LED industry has taken the lead into the high-power