论文部分内容阅读
采用中频磁控溅射制备了WSx薄膜,通过X射线衍射(XRD)、场发射扫描电子显微镜(FESEM)、原子力显微镜(AFM)和X射线光电子能谱(XPS)对其结构进行了分析,采用纳米压入仪(Triboindenter)和真空球-盘摩擦试验机分别考察了薄膜的力学性能和摩擦磨损性能.结果表明:改变溅射功率密度和气压,将引起选择性溅射与薄膜氧化程度的变化,致使薄膜S/W原子比随之变化,薄膜的S/W原子比随着溅射功率密度的增加先减小后增大,而随着溅射气压的增大逐渐增大.薄膜S/W原子比较低时,薄膜W含量较高,薄膜结构较致密、硬度较高,但摩擦系数较大、耐磨性能较差;随着S/W原子比的增大,薄膜中WS2含量显著增加,W含量明显下降,摩擦系数降低,耐磨性能明显改善.
WSx thin films were prepared by MF magnetron sputtering and their structures were analyzed by X-ray diffraction (XRD), field emission scanning electron microscopy (FESEM), atomic force microscopy (AFM) and X-ray photoelectron spectroscopy The mechanical properties and friction and wear properties of the films were investigated by using a Triboindenter and a vacuum ball-disk friction tester.The results show that changing the sputtering power density and pressure will cause the change of the selective sputtering and the film oxidation , The atomic ratio of S / W changes with the increase of sputtering pressure, the S / W atomic ratio decreases first and then increases with the increase of sputtering power density, and then increases with the increase of sputtering pressure.S / When the W atomic ratio is low, the W content of the film is higher, the film structure is denser, the hardness is higher, but the friction coefficient is larger and the wear resistance is poor. With the increase of the S / W atomic ratio, the content of WS2 in the film increases significantly , W content decreased significantly, the friction coefficient decreased, wear resistance improved significantly.