论文部分内容阅读
本文叙述了印刷线路板随着集成电路被大量地采用而带来不容忽视的通风散热的问题,着重对印刷线路板的工作环境进行了分析并较详细地进行了模拟单扳热分析。通过以上的分析文章最后提出了进行印刷板路热设计的一些可行的可供参考的措施和办法。
This paper describes the printed circuit board with the integrated circuit is used in large quantities to bring about the issue of ventilation and cooling can not be ignored, focusing on the printed circuit board working environment was analyzed and more detailed simulation of a single pull-plate heat analysis. Through the above analysis of the article finally put forward some feasible reference methods and methods for thermal design of printed circuit board.