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SOC(系统芯片)和SiP都表示在一个封装内进行信号的传输和处理,并都作为是系统的封装解决方案。两者的差别在于,SOC是由单芯片系统构筑的封装,而SiP是由几个籽芯组成的系统构筑而成的封装。据Semico公司报道,世界SiP营收将从2002年的8200万美元增长到2007年的
Both SOC and SiP represent the transmission and processing of signals in a single package and serve as the system’s packaging solution. The difference between the two is that the SOC is a package built by a single-chip system and SiP is a package built by a system of several seed cores. According to Semico, the world’s SiP revenue will rise from 82 million U.S. dollars in 2002 to