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利用Abaqus有限元分析方法分析了温度循环条件下CPU和DDR双芯片SiP封装体的应力和应变分布。比较了相同的热载荷下模块尺寸以及粘结层和塑封体的材料属性对SiP封装体应力应变的影响。结果表明,底层芯片、粘结层和塑封体相接触的四个边角承受最大的应力应变。芯片越薄,SiP封装体所承受的应力越大;粘结层越薄,SiP封装体所承受的应力越小。塑封体的材料属性比粘结层的材料属性更显著影响SiP封装体应力应变,当塑封体的热膨胀系数或杨氏模量越大时,SiP封装体所受应力也越大。
The stress and strain distributions of CPU and DDR dual-chip SiP packages under temperature cycling conditions were analyzed using Abaqus finite element analysis. The influence of the module size and the material properties of the adhesive layer and plastic package on the stress-strain of SiP package under the same thermal load is compared. The results show that the four chips that are in contact with the underlying chip, the adhesive layer and the plastic encapsulation bear the greatest stress and strain. The thinner the chip, the greater the stress that the SiP package is subjected to; the thinner the adhesive layer is, the less stress the SiP package will bear. The material properties of the plastic encapsulant affect the stress and strain of the SiP package more significantly than the material properties of the adhesive layer. As the thermal expansion coefficient or Young’s modulus of the plastic encapsulant increases, the stress on the SiP package increases.