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采用DYNAFORM软件对转K5弹簧托板基于实体单元进行冲压仿真分析。分析结果表明,转K5弹簧托板不会出现破裂和过度减薄的缺陷,但成型回弹后存在弹簧托板端部弹簧承台面平面度和冲压成型高度值超差。根据仿真结果,采用在冲压模具端部增加反变形镶块并增加上、下模的高度尺寸方案进行模具优化,通过仿真和转K5弹簧托板冲压试验进行分析验证,结果表明模具优化方案能有效解决弹簧承台面平面度和冲压成型高度值超差问题。
DYNAFORM software is used to conduct the simulation analysis of the K5 spring pallet based on the physical unit. The analysis results show that the K5 spring pallet does not suffer from the defects of rupture and over thinning. However, there is spring plate abutment flatness and stamping height value tolerance after forming rebound. Based on the simulation results, the mold optimization was carried out by adding anti-deformation inserts at the end of the stamping die and increasing the height dimension of the upper and lower dies. The simulation and the stamping test of the K5 spring plate were carried out to verify the results. The results showed that the die optimization scheme was effective Solve the spring bearing surface flatness and stamping height value of ultra-poor problems.