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半导体表面杂质的清洗工艺是半导体器件生产中关键的工艺之一,它对器件性能有很大影响.目前普遍使用腐蚀性强的硝酸、盐酸、硫酸、过氧化氢和氢氧化铵等酸碱,以及毒性较大的甲苯、四氯化碳、丙酮等有机溶剂进行清洗,产生大量废水、废气,以致损害工作人员健康,造成环境污染.此外,这些高纯试剂价格较贵,清洗成本高.因此,近年来有关单位在这方面进行了探索,期望能找到一种新的半导体清洗剂,以改善这种状况.
The semiconductor surface impurity cleaning process is one of the key processes in the production of semiconductor devices, which has a great impact on device performance.Now commonly used corrosive nitric acid, hydrochloric acid, sulfuric acid, hydrogen peroxide and ammonium hydroxide and other acids and bases, As well as toxic toluene, carbon tetrachloride, acetone and other organic solvents to clean, resulting in a large amount of waste water, emissions, resulting in damage to staff health, resulting in environmental pollution.In addition, these high purity reagents expensive, high cleaning costs. In recent years, the relevant agencies have conducted exploration in this regard, hoping to find a new semiconductor cleaning agent to improve the situation.