本系统对过去一些浸渍冷却设计作了改进,使得被冷却元件的组装具有更大的灵活性。随着固体电子元件的发展,元件更趋小型化,已经研究成功多种方法把元件热量排走。但常用的空气对流冷却似乎已达到其极限。保证达到充分冷却所需的空气量很大,这会导致产生很大的噪声。其它一些方法也不能使大量的元件中每一个都能控制其工作温度在很窄的要求范围内。在大型电子计算机中,也设计了多种空气-液体混合冷却系统。最近还研制出 The system improves on some of the impregnation cooling designs of the past, allowing for greater flexibility in the assembly of the components being cooled. With the development of solid electronic components, the components are more miniaturized, and successful methods have been studied to dissipate the heat of the components. However, the common convection cooling seems to have reached its limit. The amount of air required to ensure adequate cooling results in a significant amount of noise. Other methods do not allow each of a large number of components to control their operating temperature within a narrow range of requirements. In large computers, a variety of air-liquid hybrid cooling systems are also designed. Recently also developed