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高速、高性能MCM中，往往把电路设计在欠阻尼小振荡输出的工作状态，以保持信号在互连传输线中的快速和平稳传播。已有文献关于互连延时的研究往往是针对过阻尼或欠阻尼大振荡工作状态，即对应于通常的IC和PCB互连，即使对高速VLSI互连延时的研究，考虑到计算的复杂性和有效性，也往往只处理过阻尼和欠阻尼大振荡两种状态，因此若将给出的结果用于研究MCM互连延时，误差相当大甚至无效。本文提出了一种研究MCM互连延时的方法，并给出了延时在3种工作状态下与各物理参数之间的确定公式。
In high-speed, high-performance MCM, the circuit is often designed to work in a state of underdamped small oscillation output in order to keep the signal propagating rapidly and smoothly in interconnected transmission lines. The literature on interconnect delay is often directed against overdamped or underdamped large oscillating operation, which corresponds to the usual interconnection of ICs and PCBs, even for the study of high speed VLSI interconnection delay, taking into account the complexity of computation Both the damping and the underdamped large oscillations are often dealt with both in terms of effectiveness and effectiveness. Therefore, if the results given are used to study the MCM interconnection delay, the error is quite large or even invalid. In this paper, a method to study the delay of MCM interconnection is proposed and the formula for determining the delay between the three working states and each physical parameter is given.