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采用简化的内氧化工艺制备了Al2O3/Cu复合材料,研究不同内氧化时间(3～10h)及不同变形量(20%～80%)下的Al2O3/Cu复合材料的显微硬度和导电率,并对其显微组织进行了分析。结果表明:内氧化法制备的Al2O3/Cu复合材料中弥散分布着纳米级的Al2O3颗粒;复合材料的表面和内部的晶粒大小明显不同,表面晶粒较小(粒径10～30μm);冷加工变形量越大,Al2O3颗粒与位错的缠结越严重;经900℃内氧化制备的Al2O3/Cu复合材料具有良好的导电率和显微硬度。
Al2O3 / Cu composites were prepared by a simplified internal oxidation process to study the microhardness and electrical conductivity of Al2O3 / Cu composites with different internal oxidation time (3 ~ 10h) and different deformation (20% ~ 80% The microstructure was analyzed. The results show that nano-sized Al2O3 particles disperse and distribute in the Al2O3 / Cu composites prepared by the internal oxidation process. The surface and internal grain sizes of the composites are obviously different, the surface grains are smaller (10 ~ 30μm in diameter) The larger the amount of deformation, the more severe the entanglement of Al2O3 particles and dislocations. The Al2O3 / Cu composites prepared by oxidation at 900 ℃ have good electrical conductivity and microhardness.