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从集总参数模型出发 ,初步分析了热敏电阻型热探针的热传导机制和热物性测量机理 ,说明了扫描热探针的信号与样品表面温度、样品与探针间的热阻以及样品热导率等因素有关。在不同的工作条件下 ,可分别用以进行表面的温度分布和微区热导分布等热参数的测量。选定 Si- Si O2 标准样品 ,定性地讨论了表面形貌和样品热导率对测量结果的影响。把扫描热显微镜用于复合材料研究 ,得到的热像图提供了微区热导分布的信息
Based on the lumped parameter model, the thermal conduction mechanism and thermophysical properties of the thermistor-based thermal probe are analyzed. The signal of the thermal probe and the surface temperature of the sample, the thermal resistance between the sample and the probe, Conductivity and other factors. Under different working conditions, the thermal parameters such as the surface temperature distribution and the thermal distribution in the micro-zone can be respectively measured. Selected Si-Si O2 standard samples, qualitatively discussed the surface morphology and thermal conductivity of samples on the measurement results. Using scanning thermal microscopy for composite research, the thermograms obtained provide information on the distribution of the micro-domain thermal conductances