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无论是透明或不透明的固体试样,热波电子显微镜均能利用试样的微观热学性质对其表面和亚表面进行无损检测和成象。本文首先对热波电子显微镜成象机理和特性进行了分析。其次,介绍了热波电子显微镜的研制,实验获得的图象与理论分析计算相符合。此外,讨论了热波电子显微镜应用的典型例子——集成电路亚表面缺陷无损检测和成象。
Whether transparent or opaque solid samples, thermal electron microscopy can utilize the microscopic thermal properties of the sample for non-destructive detection and imaging of its surface and subsurface. This paper first analyzes the imaging mechanism and characteristics of thermal wave electron microscopy. Secondly, the development of thermal wave electron microscope is introduced. The experimental images are in good agreement with the theoretical analysis and calculation. In addition, a typical example of the application of thermal wave electron microscopy - nondestructive testing and imaging of sub-surface defects in integrated circuits is discussed.