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热载流子注入(hot carrier injection,HCI)效应和负偏压温度不稳定性(negative biastemperature instability,NBTI)是集成电路中重要的前段器件工艺可靠性测试项目。通过引入工业统计学,详细讨论了在不同工艺制造情况或测试环境下HCI/NBTI效应可靠性差异的比较方法。这些对于HCI/NBTI测试比较方法的总结,有利于合理分析工艺可靠性测试结果,协助晶圆生产部门找出失效机理,不断改善工艺制程并保持工艺的稳定性。
Hot carrier injection (HCI) and negative bias temperature instability (NBTI) are important pre-device process reliability tests in integrated circuits. Through the introduction of industrial statistics, a detailed comparison of the HCI / NBTI effect reliability differences in different manufacturing processes or test environments is discussed. These summaries of the HCI / NBTI test comparison methods are helpful for a reasonable analysis of the process reliability test results, helping the wafer production department to find out the failure mechanism, continuously improve the process and maintain the process stability.