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一、引言 芯片焊接的目的:把芯片牢固的粘在管座上;有良好的导电性·对于硅平面管,硅片衬底兼作集电极,因而要求管芯与底座形成欧姆接触。 粘结的方法有:银浆粘结;合金粘结,导电胶粘结;环氧树脂粘结;高温聚亚胺胶粘结。 银浆粘结不牢固、不稳定,抽样检查结果也不一致,在20020000g离心试验下大量脱落、严重影响产品可靠性与稳定性,
First, the introduction of the purpose of chip welding: the chip firmly stuck to the tube seat; have good electrical conductivity for silicon planar tube, double as the collector silicon substrate, which requires the formation of ohmic contact with the base die. Bonding methods are: silver paste bonding; alloy bonding, conductive adhesive bonding; epoxy bonding; high temperature polyimide adhesive. Silver paste is not strong, unstable, sample test results are inconsistent, a large number of off in 20020000g centrifuge test, seriously affecting the reliability and stability of the product,