该文论述了各种各样的ＰＶＤ工艺：蒸发、离子镀和溅射，以及采用这些技术淀积厚膜的问题。总 结了影响厚膜性能和显微组织的工艺参数。略述了这种膜的各种用途。 本文叙述了三种物理气相淀积工艺：蒸发、离子镀、溅射，这些工艺的最新发展，淀积物的组织结 构和特性，目前可能获得的应用。用ＰＶＤ技术淀积的厚膜，成型自然，或象涂层一样，或象自持的形 状（即薄膜、箔、壳）。该读本全面详细地谈到了这些问题。（１） This article addresses a wide range of PVD processes: evaporation, ion plating and sputtering, as well as the problem of using these techniques to deposit thick films. Summarized the process parameters affecting thick film properties and microstructure. The various uses of this film are outlined. This article describes three physical vapor deposition processes: evaporation, ion plating, sputtering, the latest developments in these processes, the organization and properties of the deposits, and the possible applications available today. Thick films deposited by PVD techniques can be formed naturally, either as coatings or as self-supporting shapes (ie, films, foils, shells). The reader addresses these issues in full detail. (1)