前言国内外有关无氰电镀铜锡合金的研究曾有过多种报导。这些电解液存在的主要问题是在直接镀复时,镀层与钢铁基体金属结合不牢,工作电流密度小,阳极容易钝化,电解液不够稳定等。其中,解决结合强度问题多半是采用预镀和化学浸镀的办法,并配合以极严格的前处理过程。作为黄血盐的无氰体系国外曾有过两篇简单的研究报告.国内在无氰镀银的研究中也曾对此体系作过报告。用锡酸盐——黄血盐镀液电镀铜锡合金只要经过很简单的常规前处理,就可以在钢铁基体上直 Preface There have been many reports on the researches of non-cyanide copper-tin alloys at home and abroad. The main problems existing in these electrolytes are that the coating is not firmly bonded to the steel substrate metal, the working current density is small, the anode is easily passivated, and the electrolyte is not sufficiently stable during direct plating. Among them, the solution to the problem of bond strength is mostly pre-plating and chemical immersion plating methods, and with a very strict pre-treatment process. As a non-cyanide system of yellow blood salt abroad, there have been two simple research reports in the domestic research on cyanide-free silver has also made a report on this system. With stannate - yellow blood bath plating copper-tin alloy as long as after a very simple conventional pre-treatment, you can straight on the steel substrate