论文部分内容阅读
为研究Cu/Ni多层膜的调制波长与力学性能的关系,采用计算机控制的单槽双脉冲控电位沉积系统,在Cu基体上沉积Cu/Ni多层膜,分别采用扫描电镜和纳米压痕技术对Cu/Ni多层膜的截面和硬度进行了测试.结果表明:电沉积方法制备的Cu/Ni多层膜具有良好的周期结构;在调制波长为37 nm时硬度达到极值;在调制波长小于37 nm时其硬度值明显下降.实验结果符合理论分析中多层膜的硬度随调制波长的变化规律,但临界调制波长大于理论计算结果.
In order to study the relationship between the modulation wavelength and the mechanical properties of Cu / Ni multilayers, a single-slot dual-pulse controlled potential deposition system controlled by computer was used to deposit Cu / Ni multilayers on the Cu substrate. Scanning electron microscopy and nanoindentation Technology was used to test the cross section and hardness of the Cu / Ni multilayers. The results show that the Cu / Ni multilayers prepared by electrodeposition have a good periodic structure; the hardness reaches the extreme value at the modulation wavelength of 37 nm; When the wavelength is less than 37 nm, its hardness decreases obviously.The experimental results are consistent with the rule that the hardness of the multilayer film changes with the modulation wavelength in theory, but the critical modulation wavelength is larger than the theoretical calculation.