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一、光刻光刻指的是:在金属或非金属的被加工材料上,均匀地涂上一层光抗剂,用照相晒象法,形成“光抗剂图形”,然后把被加工材料的露出部分用化学或电气化学的方法,进行蚀刻,从而在被加工材料面上获得所需的精密图形的方法。在半导体领域中,随着比场效应集成电路的集积度高2—3倍的大规模集成电路的出现,对光刻技术提出了越来越高的要求。为此,要进一步发展制版、光抗剂、蚀刻等技术。1.制版光刻用的版,通常是卤化银玻璃板。这种版的分辨率在几个微米以上,对半导体加工而言,要求分辨率在1μ左右,此时,由于下述
First, the lithographic lithography refers to: in the metal or non-metallic materials are processed, evenly coated with a layer of photo-resist agent, with the photo-imaging method to form a “photo-resist pattern”, and then the material being processed Of the exposed part of the chemical or electrochemical methods, the etching, so as to obtain the desired precision of the surface of the material to be processed graphics. In the field of semiconductors, with the emergence of large-scale integrated circuits that are 2 to 3 times higher than those of field effect integrated circuits, higher and higher requirements are placed on lithography. To this end, we should further develop plate-making, photochemical agents, etching and other technologies. 1. Plate lithography version, usually silver halide glass. This version of the resolution of several microns or more, for semiconductor processing, the resolution required about 1μ, at this time, due to the following