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市场的需求促进了电子产品的发展。当前电子整机日渐趋向小型化、薄型化、轻量化和高可靠化,其内部的电子元件也越做越小,组装密度越来越高。“轻薄短小”这四个字形象地表达了电子产品开发的一个重要动向,这就是高密度化。随着电子工业的发展,元器件表面组装技术(英文缩写SMT)作为一种新型微电子高密度组装技术正在迅速崛起。SMT最早用于瑞士钟表业,后来美国将该技术用于军事类电子装备和计算机中。如今世界各国竞相开发,使其在国防和民用,航空和航天,电子仪器仪表,电视机,摄录像机,传真机,通讯设备等研究和生产制造领域得到广泛的应用。 比菜籽还小的元器件用手工根本无法安装,而SMT采用微电脑控制的精密机械设备可以高速、可靠地自动完成点焊膏、点胶、固化、焊接、清洗等装配全过程。首先用计算机控制的机械手通过温度和压力的调整,在印刷线路板上规定位置均匀滴涂焊膏,然后智能型高速自动贴片机把元器件自动装贴在各个涂胶部位,经组装完成的印刷线路板被送进焊接系统进行一次性整体同步焊接,焊接过程中用微机严格控制升温、焊接和冷却过程。
The demand of the market has promoted the development of electronic products. At present, electronic devices are becoming more and more miniaturized, thinner, lighter and more reliable. The internal electronic components are getting smaller and smaller, and the assembly density is getting higher and higher. “Thin and light,” these four words vividly expressed an important trend in the development of electronic products, which is high density. With the development of the electronics industry, component surface mount technology (SMT) is rapidly emerging as a new type of microelectronic high density assembly technology. SMT was first used in the Swiss watch industry, the United States later the technology used in military electronic equipment and computers. Nowadays, all countries in the world are competing for development, making them widely used in research and manufacturing of national defense and civil, aviation and aerospace, electronic instrumentation, television sets, video cameras, fax machines and communications equipment. Components smaller than rapeseed can not be installed manually by hand, while SMT uses microcomputer-controlled precision machinery and equipment to automate the whole process of spot welding, dispensing, curing, welding and cleaning at high speed and reliability. First of all, with a computer-controlled manipulator through temperature and pressure adjustment, the printed circuit board at a predetermined location evenly drops of solder paste, then intelligent high-speed automatic placement machine components automatically affixed to the various parts of the glue, the assembly completed Printed circuit board was sent to the welding system for a one-time overall synchronous welding, the welding process using computer strict control of heating, welding and cooling process.