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以紫铜片为基体,采用电镀或化学镀法分别制备了Ni、Sn、Ni–P以及Ni–Sn–P镀层。通过测定Tafel极化曲线和电化学阻抗谱,对比研究了不同镀层在pH=5.5的3.5%NaCl溶液和pH=5.8、含水量20%的土壤中的电化学腐蚀性能。结果表明,4种镀层在所研究的酸性介质中均具有比金属铜更强的电化学极化阻力;化学镀Ni–Sn–P镀层在弱酸性介质中具有最好的耐蚀性;除电镀Ni层外,其他镀层的自腐蚀电位均负于铜基体,为阳极性镀层。根据所有实验结果的综合分析,可以预期,Ni–Sn–P和Ni–P镀层用作铜接地线在酸性或弱酸性土壤中的保护性镀层具有很好的应用前景。
Taking the copper plate as the substrate, Ni, Sn, Ni-P and Ni-Sn-P coatings were respectively prepared by electroplating or electroless plating. The electrochemical corrosion behavior of different coatings in 3.5% NaCl solution with pH = 5.5 and pH = 5.8 and 20% water content was studied by measuring Tafel polarization curve and electrochemical impedance spectroscopy. The results show that the four kinds of coating have more electrochemical polarization resistance than metallic copper in the studied acidic medium. Electroless Ni-Sn-P coating has the best corrosion resistance in weak acid medium. Ni layer, the other corrosion resistance of the coating are negative on the copper substrate, the anode coating. Based on a comprehensive analysis of all the experimental results, it is expected that Ni-Sn-P and Ni-P coatings have good application prospects as protective coatings for copper ground wire in acidic or weakly acidic soils.