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为提高IC封装过程中钉头Au凸点制备效率,需对Au凸点的形成机理进行分析,得出影响Au凸点质量的各种工艺参数。采用有限元仿真与实验相结合的方法,针对不同的劈刀剪切速度模拟剪切断丝过程,并在实际的引线键合机上进行实验。结果显示劈刀剪切速度越大,劈刀剪切Au丝时所受的作用力越小,但减小幅度不大。分析表明,当劈刀以较低速度进行剪切断丝时,需要克服较大的位错滑移能,而随着速度提高,滑移系增多,Au丝获得的热量增多,使得材料的塑性降低,从而能够减小剪切断丝时的剪切力,但由于Au丝的直径较小,剪切速度相对剪切距离又较大,所以剪切力的减小幅度对剪切过程影响有限,而且不同的剪切速度均能得到共面性较好的钉头Au凸点。
In order to improve the preparation efficiency of Au bumps in the process of IC packaging, the formation mechanism of Au bumps needs to be analyzed to obtain various process parameters that affect the quality of Au bumps. The method of combining finite element simulation and experiment was used to simulate the cutting and breaking process according to the different chopper shear rate and the experiment was carried out on the actual wire bonder. The results show that the larger the chopper cutting speed, the chopper cutting Au wire the smaller the force suffered, but not to a lesser extent. The analysis shows that when the chopper cuts the filaments at lower speed, the larger slip dislocation energy needs to be overcome. With the increase of velocity, the slip system increases and the heat gain of the Au filaments increases, which makes the plasticity So that the shearing force during shearing can be reduced. However, due to the smaller diameter of the Au wire and the relatively large shearing velocity relative to the shearing distance, the reduction of the shearing force has a limited effect on the shearing process , And different shear rate can get better coplanarity Au head bump.