莱迪思半导体公司宣布第一批256-Ball caBGA封装的XO3-L 2200,4300和6900器件开始发货,这是超低密度MachXO3现场可编程门阵列(FPGA)系列中首批发货的器件,MachXO3是体积极小、每I/O成本极低的可编程平台,旨在扩大系统功能并且使用并行和串行I/O实现新兴互连接口的桥接。三个月前MachXO3系列发布,配合先进的小尺寸封装和片上资源,MachXO3系列使得系统架构师可以方便地实现新兴互连接口设计,如MIPI、PCIe、千兆以太网等, Lattice Semiconductor Announces Availability of First XO3-L 2200, 43300, and 6900 Devices in 256-Ball caBGA Package, First-in-Package for Ultra-Low-Density MachXO3 Field-Programmable Gate Array (FPGA) Family , The MachXO3 is a small, programmable platform with very low I / O costs and is designed to expand system functionality and bridge new interfaces to emerging interconnects using parallel and serial I / O. With the release of the MachXO3 family three months ago, coupled with advanced small footprint and on-chip resources, the MachXO3 family enables system architects to easily implement emerging interconnect interface designs such as MIPI, PCIe, Gigabit Ethernet,