在混合或其他电路中,无封装的半导体片虽然能减少器件封装的费用,但大多数器件都相当脆弱,必须非常仔细地操作才不致损坏或沾污。采用的玻璃钝化虽然减少捐坏,但是在热应力下器件边缘会发生少量的碎裂现象,并引起器件沾污。对杂质极为敏威的三端交流开关器件尤为麻烦。在玻璃纯化半导体开关元件中,通常在有源区周围淀积玻璃槽,将结隔离开。但是,在 In mixed or other circuits, unpackaged semiconductors, while reducing the cost of device packaging, are fragile and must be handled very carefully without damage or contamination. Glass passivation, while reducing donation, causes a small amount of fragmentation at the edge of the device under thermal stress and causes device contamination. Extremely sensitive to impurities on the three-terminal AC switching device is particularly troublesome. In glass-purified semiconductor switching devices, glass trenches are typically deposited around the active region to separate the junction. But when