Au80Sn20相关论文
Au80Sn20合金是一种广泛应用于微电子封装的共晶钎焊材料，本文采用包覆循环过热法研究了Au80Sn20共晶合金的深过冷形成能力和深过冷......
Au80Sn20 alloy is a widely used solder for laser diode packaging.In this paper,the thermal resistance of GaN-based blue ......
电子元器件常通过镀层提高可焊性,主要包括Au、Ni、Cu、Au/Ni(Ti)、Au/Pt/Ti、Au/TiW等。Au80Sn20焊料是电子封装中的常用材料,文......
随着电子产品小型化、无铅化的发展,对焊接材料提出了更高的要求。无铅钎料Au80Sn20由于具有优良的力学性能,在高可靠性气密封装和......
Au80Sn20 alloy is a widely used solder for laser diode packaging.In this paper,the thermal resistance of Ga N-based blue......
