Positioned between front-end and back-endprocessing in semiconductor manufacturing, waferback-side grinding,the core of ......

提出了晶圆薄化刀具的改进策略，终极钻石盘能减少晶圆薄化过程中的裂痕。可降低刀具的磨耗速度，并分别以加工参数影响实验、切削力与......