一、引言电子元器件引线可焊性差既影响整机组装的生产效率,也影响电子设备的可靠性,同时还造成重大的经济损失(我国年损失约6799万元—83年统计)。电子元器件引线可焊性问题是一个必须解决的问题,但又是一个涉及技术领域较广。工艺过程比较复杂的生产技术问题。元器件引线由引线基材和镀、涂覆层二部分组成。镀、涂覆层的主要作用是保证元器件引线在整机装联焊接过程中有好的可焊性。引线镀、涂覆层既可用电镀方法生产,也可用热涂方法来形成。与电镀法相比,热涂法具有涂覆层与基材结合牢固、生产效率高、加工成本低、公害小,调整涂层合金成份容易等优点。目前热涂法 I. INTRODUCTION The poor solderability of the electronic components leads to both the production efficiency of the whole assembly and the reliability of the electronic equipment. At the same time, it also causes significant economic losses (China’s annual loss of about 67.99 million yuan - 83 years of statistics). Solderability problems of electronic components lead is a problem that must be solved, but it is also a wide range of technologies involved. Process more complex production technology issues. Components lead by the lead substrate and plating, coating two parts. Plating, the main role of the coating is to ensure that the component leads in the whole machine welding process has good solderability. Lead plating, the coating can be used to produce the plating method can also be used to form the thermal coating method. Compared with the electroplating method, the thermal coating method has the advantages of strong adhesion between the coating layer and the substrate, high production efficiency, low processing cost, small pollution, and easy adjustment of the coating alloy composition. Current thermal coating method