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TLC—556是适合工业用电子设备的高密度化和集成电路芯片的直接焊接等而开发的耐高温铜箔叠层板,具有如下特点: (1) 能直接将元件焊到电路上。 (2) 高温时的特性好(例如在15℃的表面硬度比FR—4提高大约2倍)。 (3) 尺寸稳定性好。
TLC-556 is suitable for high density industrial electronic devices and integrated circuit chips such as direct welding developed high temperature copper foil laminated board, has the following characteristics: (1) the components can be soldered directly to the circuit. (2) Good properties at high temperature (for example, surface hardness at 15 ° C is about twice as high as that of FR-4). (3) good dimensional stability.