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通过硬度、导电率测量以及金相分析,研究了直接添加法和合金添加法对触头材料用Cu-Cr-Zr合金性能的影响。结果表明:在真空熔炼条件下,对于同种工艺,随着Zr元素添加量的增加,合金硬度增加,导电率下降。与直接添加法相比,合金添加法有利于减少Zr及Cr元素的烧损;显微组织中富Cu-Zr相主要呈条状连续枝晶状致密分布;颗粒状Cr相在铜基体上的分布相对均匀、致密,得到的Cu-Cr-Zr合金硬度、导电率高一些。
The effects of direct addition method and alloy addition method on the properties of Cu-Cr-Zr alloy for contact materials were investigated by hardness, conductivity measurement and metallographic analysis. The results show that under the condition of vacuum smelting, for the same kind of process, the hardness of the alloy increases and the conductivity decreases with the increase of Zr content. Compared with the direct addition method, the alloy addition method is conducive to reducing the loss of Zr and Cr elements; the Cu-Zr rich phase in the microstructure is mainly distributed in the form of continuous dendrites densely distributed; the distribution of the granular Cr phase on the copper matrix is relatively Uniform, dense, get Cu-Cr-Zr alloy hardness, higher conductivity.