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通过两次高频感应重熔制备了Cu焊盘上S n3．5Ag焊料和Sn3．0Ag0．5Cu焊料凸台,并进行了120℃下的老化试验以及老化试件的剪切强度试验,分析了不同老化时间下两种无铅焊料凸台的剪切断裂模式。焊料凸台的剪切载荷-位移曲线的特征以及对焊料凸台剪切断口的扫描电镜形貌分析结果表明,不同老化时间下无铅焊料凸台的剪切断裂表现为塑性、韧性和脆性三种断裂模式。对凸台焊料合金的组织以及界面观察结果表明,随老化时间不断生长的脆性金属间化合物层以及焊料组织粗大是致使断裂失效模式转变的根本原因。
The S n3.5Ag solder and Sn3.0Ag0.5Cu solder bumps on the Cu pad were prepared by two high frequency induction remelt, and the aging test at 120 ℃ and the shear strength test of the aged samples were carried out. Shear fracture modes of two lead - free solder bosses under different aging times. The characteristics of the shear load-displacement curve of the solder bump and the SEM analysis of the solder bump shear fracture show that the shear fracture of the lead-free solder bump under different aging time shows plasticity, ductility and brittleness Fracture mode. The microstructure and interfacial observation of the solder bump indicates that the brittle intermetallic compound layer with growing aging time and the coarse solder microstructure are the fundamental causes of the failure mode transition.