Down to the road of miniaturization and high power density, the heat dissipation is becoming one of the critical factors......

Target assembly is a key consumable material for producing thin film used in the electronic packaging and devices.The re......

Wettability of molten Sn-Ag-Cu alloy on Cu substrate has been determined by sessile drop method, as well as its dependen......

The addition of Cu nanoparticles into the solder pastes by mechanical mixing method creates a positive effect on the mic......

Sn-Ag alloy system has been regarded as one of the most promising lead-free solder to substitute conventional Sn-Pb eute......

7A52 Al alloy plate aged at 105 ℃ for 8 h and then at 130 ℃ for 24 h was welded by means of TIG using Al- 6.3Mg-0.35Sc......

The intermetallic compound (IMC) is hard and brittle,and its forming and growth at soldering joint interface is an impor......

Sn-rich Au–Sn solder bonding has been systematically investigated for low cost and low temperature wafer-level packagin......

The transient thermal characteristics of the ridge waveguide InAsP/InGaAsP MQW lasers, especially in various pulse drivi......

A simulation method for the thermal analysis of InAlAs/InGaAs/InP mid-infrared quantum cascade lasers (QCLs) based on fi......

Advanced testing methods for the dynamics of mechanical microdevices are necessary to develop reliable, marketable micro......

High power broad area semiconductor lasers have found increasing applications in pumping of solid state laser systems an......

一、前言锡铅焊料是电子、通讯、航空等工业广泛使用的钎焊材料。目前使用的含锡61％、含铅39％的共晶合金焊料(HLSnPb39)在液态下暴......

A novel wafer level bonding method based on Cu-Sn isothermal solidification technology is established. A multi-layer sea......

Electromigration(EM) behavior of Cu/Sn3.5Ag/Cu solder reaction couple was investigated with a high current density of 5 ......

A novel electroplating indium bumping process is described,as a result of which indium bump arrays with a pitch of 100μ......

Au/Sn solder bonding on Si substrates was used to fabricate the GaN-based vertical structure light emitting diodes (VSLE......

High-power vertical-cavity surface-emitting lasers(VCSELs) are processed using a wet thermal-selective oxidation techniq......

The package and system level temperature and thermal stress distributions of 10 W light emitting diode (LED) with 4 chip......

With development of miniaturization,high integration,multifunction and high efficiency of electronic packaging technolog......

This paper studies the typical failure modes and failure mechanisms of non-wetting in an FCBGA(flip chip ball grid array......

Bi layer formation in Cu/Sn–58Bi/Cu solder joints was investigated with different current densities and solder thicknes......

A novel low-cost and high-speed via filling method using Cu-cored solder balls was investigated for through-silicon via ......

热疲劳失效是电子封装中焊点失效的主要形式。本实验通过自行设计模拟焊点试样并在上面粘贴应变片的方法,观察了Pb-Sn共晶焊料和新......

We present a 940 nm quasi-continuous wave semiconductor laser designed as a building block for high-power fiber coupled ......

Metallurgical challenges in controlling the microstructural stability of Cu and solder microbumps in 3D IC packaging tec......

Light source modules are the most crucial and fragile devices that affect the life and reliability of the interferometri......

Solder size effect on early stage interfacial intermetallic compound(IMC) evolution in wetting reaction between Sne3.0Ag......

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Our equipment is GT800 reflow solder. It has 16 temperature zones (not include cooling zone). The conveyor speed can be......

空洞缺陷是BGA焊接缺陷中比较常见的一种,主要由回流焊时产生的气体没有及时排出而导致。X射线无损检测技术可以使空洞缺陷在焊球......

研究Sn Ag Cu Fe焊点的本构方程,采用拉伸测试拟合本构模型的9个参数。基于有限元模拟应用Anand模型分析WLCSP30器件Sn Ag Cu Fe焊......

SnCu solder is one of the most promising substitutes of SnPb solder, but its creep resistance is worse than that of the ......

Lap joints with a 1 mm2 cross-sectional area were fabricated using Cu particle enhancement 63Sn37Pb based composite sold......

Particle reinforced Sn-Zn based composite solders were obtained by adding Cu powders to Sn-9Zn melts. The microstructure......

Problems about surface mounting process for fine pitch devices and reasons on solder bridging of L type leaddevices wel......

Void damage is the main failure characteristics of constrained ductile metal foil. In order to evaluate the mechanical ......

Nonlinear finite element simulation for mechanical response of surface mounted solder joint under different temperature ......

Interactions between 63Sn37Pb solder and PBGA metallization (Au/Ni/Cu) duringlaser and infrared reflow soldering were s......

A comprehensive experimental and numerical study of solder joints for plastic leaded chip carrier (PLCC) 84-Pin, 1.27 mm......

A lead-free solder composite was prepared by adding ZrO2 nanopowders in eutectic Sn-Ag alloy. Microstructural features a......

Nanoindentation was used to probe softening of the eutectic microstructure in a SnBi/Cu interconnect following thermal a......

Based on environmental considerations, global economic pressures, enacted by legislations in several countries, have war......

The interfacial phenomena of the Sn-Pb solder droplet on Au/Ni/Cu pad are investigated. A continuous AuSn2 and needle-li......

A lead-free Sn-3.5Ag solder was prepared by rapid solidification technology. The high solidification rate, ob-tained by ......

The potential of using a hypoeutectic, instead of eutectic, Sn-Zn alloy as a lead-free solder has been discussed. The no......

The effects of Bi addition on the growth of intermetallic compound (IMC) formation in Sn-3.8Ag-0.7Cu solder joints were ......

The microstructure and microhardness of Sn-3.5%Ag solders were explored in the cooling rate ranging from 0.08 to 104 K/s......

An experimental study on the microstructures of a rapid directionally solidified metallo-eutectic Sn-Cu alloy was carrie......

Effects of micro-amount of rare earth Ce on microstructures of Sn-3.0Ag-0.5Cu solder alloy were studied. The results ind......