前言近年来电子设备的可靠性和性能显著提高,要求印刷电路板的组装密度,可靠性和‘电性能作进一步改进,这些问题只有通过发展新的板材,镀敷和制造加工工艺才能解决。为满足上述要求,我们发展了两种新型复铜箔层压板,一种是复薄铜箔层压板,所用铜箔比常用的1/2盎司的薄,外面有铝箔保护。另一种是粗表面层压板、线路可用无电电镀法直接印制在上面。 INTRODUCTION The reliability and performance of electronic devices have dramatically increased in recent years, requiring further improvements in assembly density, reliability and electrical performance of printed circuit boards that can only be resolved by developing new panels, plating and manufacturing processes. To meet the above requirements, we have developed two new types of copper clad laminates, one of which is a multilayered copper foil laminate with a 1/2 ounce thinner copper foil and a foil protection on the outside. The other is the rough surface laminate, the circuit can be printed directly on the electroless plating method above.