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随着电子工业的发展,所用印制电路板向着高精度、高密度、高可靠性的方向发展,对绝缘基材,也不断提出新的要求。通常用的酚醛纸板、环氧玻璃布板,不能完全满足要求了。为部分电子产品的需要,绝缘基材已从低频发展到高频,从刚性发展到挠性,从减成法基材到加成法基材和多层布线等。
With the development of the electronics industry, printed circuit boards used in the direction of high precision, high density, high reliability, the insulation substrate, but also continue to put forward new requirements. The commonly used phenolic cardboard, epoxy glass cloth, can not fully meet the requirements. For the needs of some electronic products, the insulating base material has been developed from low frequency to high frequency, from rigid to flexible, from minus to method substrate to additive substrate and multilayer wiring.