论文部分内容阅读
一个电子系统的液冷装置特别适用于冷却安装在基片上的大规模集成电路芯片。这个系统有一个或多个热交换器,内部有冷却剂循环。每个热交换器都有一个易变形壁,热交换器的安装使此壁紧密地与要冷却的基片表面接触。因为热交换器内冷却剂有压力,通过热交换器壁,在被冷却的基片和流经热交换器的冷却剂之间就形成了一个低热阻的接触。热交换器由软管接入冷却系统,以便能在冷却剂正常通过冷却系统的情况下,很容易地移动热交换器。
An electronic system liquid cooling device is particularly suitable for cooling large scale integrated circuit chips mounted on a substrate. This system has one or more heat exchangers with internal coolant circulation. Each heat exchanger has a deformable wall, and the heat exchanger is mounted so that the wall is in close contact with the surface of the substrate to be cooled. Because of the pressure in the heat exchanger coolant there is a low thermal resistance contact between the substrate being cooled and the coolant flowing through the heat exchanger through the heat exchanger wall. The heat exchanger is connected to the cooling system by a hose so that the heat exchanger can easily be moved with the coolant normally passing through the cooling system.